PolyMide™ is a family of Nylon/polyamide based filaments. Produced with Polymaker’s Warp-Free™ technology, PolyMide™ filaments deliver engineering properties intrinsic to Nylon and ease of printing.

PolyMide™ CoPA is based on a copolymer of Nylon 6 and Nylon 6,6. The filament combines excellent strength, toughness, and heat resistance of up to 180˚C.

PolyMide™ CoPA features Polymaker's Warp-Free™ technology:

Warp-Free™ technology enables the production of Nylon-based filaments that can be 3D printed with excellent dimensional stability and near-zero warpage. This is achieved by the fine control of microstructure and crystallization behavior of Nylon, which enables the material to fully release the internal stress before solidification.

Young’s Modulus:
2223 ± 199 Mpa

Tensile Strength:
66.2 ± 0.9 Mpa

Bending Strength:
97.0 ± 1.1 Mpa

Charpy Impact Strength:
9.6 ± 1.4 kJ/m2

Glass Transition Temperature:
67˚C

Vicat Softening Temperature:
180˚C

Melting Temperature:
190˚C

NET WEIGHT: 0.75 KG (1.65 LB)